G-ray struck upon a wafer-to-wafer direct covalent bonding approach that opened a broad range of applications covering a wide range of industries. The upshot is that G-ray is now positioned to ...

The group attached the GaInP/GaInAsP top structure to the TOPCon devices by using surface-activated direct wafer bonding. They then implemented rear-side grating through nanoimprint lithography.

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

Imec has  demonstrated electrically-driven GaAs-based multi-quantum-well nano-ridge laser diodes fully, monolithically fabricated on 300 mm silicon wafers ...

Bernardette Kunert, scientific director at imec, commented, “Over the past years, imec has pioneered nano-ridge engineering, a technique that builds on SAG and ART to grow low-defectivity III-V ...

Imec, the research and innovation hub, has announced a significant milestone in silicon photonics. The organisation has been able to successfully demonstrate electrically driven GaAs-based ...

Imec, a research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically driven ...