Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key ...

Wafer bonding is the one key bulk micromachining technology. There are roughly three types of wafer bonding: direct wafer bonding, anodic bonding, and intermediate‐layer bonding. The SCREAM process is ...

G-ray struck upon a wafer-to-wafer direct covalent bonding approach that opened a broad range of applications covering a wide range of industries. The upshot is that G-ray is now positioned to ...

To overcome the limitations posed by the miniaturization of solder bump sizes and their higher resistance, direct metal bonding and hybrid bonding techniques have emerged as key breakthroughs in ...

IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...

With a LiDAR demonstration in the paper that uses one of these hybrid circuits it is demonstrated that the direct wafer bonding approach works well, and a number of optimization suggestions are ...

“This project is part of a larger pathfinding mission at imec to advance III-V integration processes towards higher technological readiness, from flip-chip and transfer-printing hybrid techniques in ...

This project is part of a larger pathfinding mission at imec to advance III-V integration processes towards higher technological readiness, from flip-chip and transfer-printing hybrid techniques in ...

over heterogeneous wafer- and die-bonding technologies and eventually direct epitaxial growth in the longer term," states Joris Van Campenhout, fellow silicon photonics and director of the ...