An all‐Cu connection technology for die‐attach and metal–metal bonding is able to provide high‐conductivity electrical connections, excellent resistance to electromigration, and avoid the formation of ...

Book Abstract: This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a ...

Fundamentally, interposer test coverage requires testing of the metal interconnects and TSVs. But as direct probing of micro-bumps is not possible, not every TSV and metal interconnect will be tested ...

3D metrology spanning chip features from nanometer scale transistors to large die interconnects, macro defect inspection of wafers and packages, metal interconnect composition, factory analytics ...

The team's new technique makes no holes and uses liquid metal microdroplets to form soft vias and planar interconnects, ...